Reflow Soldering Oven
Reflow Soldering Oven is ued in SMT process to weld SMT components on PCB. In fact, the main function of reflow soldering furnace is to weld the circuit board with SMT components, so that the components and circuit board can be combined together.
| Production | ＞ 6000 PCS/8h |
|---|---|
| Available product size | ≤540W*190H |
| Conveyor speed | 0.5-3.0 m/Min |
Size of Reflow Soldering Oven
Details about Reflow Soldering Oven
Working Process:
Its working process is through the reflow furnace transport rail transport, so that the components pasted on the solder paste are fixed together through the change of the temperature zone in the reflow furnace.
Features:
- Can be divided into zone 9 (6800mm long) and zone 11 (7800 mm long), or can be customized according to customer’s requirements.
- The size of the feed port for reflow soldering of the module is 550 mm in width and 200-300mm in height, which can be adjusted according to the actual requirements of customers.
- Reflow soldering is divided into SSR control and man-machine control.
- Higher temperature can reach 500 ℃.
Photos of Reflow Soldering Oven
Application of Reflow Soldering Oven
Production Line Planning
